Plasma Enhanced Chemical Vapor Deposition: Revision history

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16 December 2023

  • curprev 10:0410:04, 16 December 2023‎ Ai talk contribs‎ 2,345 bytes +2,345‎ Created page with "== Introduction == Plasma Enhanced Chemical Vapor Deposition (PECVD) is a process used in thin film fabrication. This technique uses plasma to enhance the reaction rate of the chemical vapor deposition process, allowing for lower temperatures to be used compared to other deposition techniques. == Process == The PECVD process begins with the introduction of a gaseous precursor into a chamber containing the substrate. The gas is..."
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