Magnetron Sputtering: Revision history

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17 May 2024

  • curprev 15:3215:32, 17 May 2024Ai talk contribs 8,343 bytes +139 No edit summary
  • curprev 15:3115:31, 17 May 2024Ai talk contribs 8,204 bytes −82 No edit summary
  • curprev 15:2815:28, 17 May 2024Ai talk contribs 8,286 bytes +8,286 Created page with "== Introduction == Magnetron sputtering is a widely used physical vapor deposition (PVD) technique for thin film deposition. It involves the ejection of material from a target by bombarding it with energetic ions, typically from a plasma, and subsequently depositing the ejected material onto a substrate. This method is highly valued for its ability to produce high-quality, uniform coatings with excellent adhesion and control over film thickness and composition. == Prin..."